| 单词 |
flip-chip bonding |
| 释义 |
flip-chip bonding- 英?[flip t?ip ?b?ndi?]
- 美?[fl?p t??p ?bɑnd??]
实用场景例句The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated. 研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性. 互联网 To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding. 热超声倒装键合作为前沿封装技术具有良好的发展前景. 互联网 The self - alignment mechanism of flip chip bonding can improve the precision and repeatability of laser coupling. 而透过覆晶封装自动对准的优点,可以改善雷射封装位置的准确性. 互联网
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